IBM and Japan’s Rapidus Expand Partnership to Develop Sub-1nm Advanced Chips

Recently, IBM and Japanese semiconductor manufacturer Rapidus announced the expansion of their collaboration, extending beyond the existing 2nm process node to the development of advanced chips below 1 nanometer. This move marks another significant milestone since the two parties established a strategic partnership in 2022, with the goal of accelerating the commercialization of next-generation semiconductor technologies.

Mukesh Khare, Vice President of IBM Research’s Semiconductor R&D division, stated: “We aim to build a long-term and in-depth partnership with Rapidus to continuously drive progress in advanced process nodes.” Currently, IBM has dispatched around 10 engineers to Rapidus’s R&D and manufacturing facility in Chitose, Hokkaido, Japan, to assist in achieving large-scale production of 2nm chips by 2027.

As early as December 2022, IBM had already licensed its 2nm chip technology to Rapidus. According to the roadmap, Rapidus aims to begin pilot production by 2025 and launch an enhanced version based on the 2nm process—referred to as 2nm+—by 2027, supporting higher-density and more complex computing applications.

Beyond process technology, the two companies are also jointly developing advanced packaging solutions, particularly focusing on chiplet integration and high-performance packaging design. In December 2024, IBM and Rapidus successfully co-developed a novel fabrication method known as “Selective Layer Reduction,” enabling the consistent production of nanosheet gate-all-around transistors with multiple threshold voltages. This innovation supports the realization of more energy-efficient and complex computing architectures.

This collaboration not only underscores IBM’s ongoing leadership in semiconductor innovation but also reflects Japan’s strategic ambition to revitalize its domestic chip manufacturing capabilities. By leveraging IBM’s technological strengths, Rapidus seeks to enhance its position in the global semiconductor supply chain and help Japan reclaim its status as a semiconductor powerhouse.

As demand for AI, high-performance computing, and autonomous driving continues to surge, breakthroughs in sub-1nm process nodes are expected to be pivotal in advancing the industry. The deepened collaboration between IBM and Rapidus holds great promise for achieving both technological and industrial breakthroughs in the coming years, contributing to the global reconfiguration of advanced manufacturing capacity.

Semiconductor technology, advanced process nodes, chip packaging technology