K4UBE3D4AB-MGCL | Samsung 32Gb LPDDR4X DRAM | High-Speed, Low-Power Mobile and Automotive Memory

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K4UBE3D4AB-MGCL

32Gb LPDDR4X high-bandwidth, low-power memory solution for automotive, mobile, and intelligent embedded systems.

Product Overview

     K4UBE3D4AB-MGCL is a 32Gb LPDDR4X DRAM device from Samsung, designed with a x32 data width and compliant with JEDEC LPDDR4X standards. Operating at speeds up to 4266 Mbps and supporting multi-voltage operation (1.8V / 1.1V / 0.6V), it delivers excellent bandwidth-per-watt performance.

     Its 200-ball FBGA package ensures strong thermal behavior, signal integrity, and integration flexibility for mobile, automotive, AI, and industrial embedded applications.

 

Key Features

  • 32Gb high-density LPDDR4X DRAM
  • JEDEC-compliant LPDDR4X standard
  • Supports up to 4266 Mbps data rate
  • x32 data width for high bandwidth
  • Multi-voltage operation (1.8V / 1.1V / 0.6V)
  • Deep sleep, self-refresh, and advanced power-saving modes
  • Ideal for AI edge workloads, automotive infotainment, and mobile platforms
  • 200-Ball FBGA high-density package

 

Applications

  • Automotive infotainment (IVI) and ADAS controllers
  • High-performance tablets and smartphones
  • Edge-AI computing modules
  • Industrial control and IoT edge terminals
  • Smart vision and imaging systems

 

Technical Specifications

Parameter Value
Density 32Gb
Organization 2G × 16 × 1 or 1G × 32
Data Rate 4266 Mbps
Voltage 1.8V / 1.1V / 0.6V
Data Width x32
Package 200-Ball FBGA
Dimensions 10 × 10 × 0.8 mm
Op Temp –25°C ~ +85°C
Refresh Auto/Self Refresh
Interface LPDDR4X

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     For real-time stock, pricing, and lead-time information for K4UBE3D4AB-MGCL, please include your Quantity (Qty), Required Lead Time, and Target Price in your RFQ.

     Our team will respond promptly with optimized pricing, BOM kitting options, spot supply, and inventory management support.

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