K4AAG165WC-BIWE000

High-performance 16Gb ×16 DDR4 memory chip for servers, automotive, and industrial applications.

Product Description

Product Overview

K4AAG165WC-BIWE000 is a 16Gb DDR4 SDRAM from Samsung Semiconductor, organized as 1G × 16 and compliant with JEDEC DDR4 standards. Operating at 1.2V and supporting data rates up to 3200 Mbps, it delivers outstanding bandwidth with low power consumption. With its 96-ball FBGA package and wide-temperature design, this device is ideal for servers, automotive systems, industrial controllers, and AI-based computing platforms that demand high reliability and endurance.

Key Features

JEDEC-compliant DDR4 SDRAM
Supports data rates up to 3200 Mbps (DDR4-3200)
Operates at 1.2V ± 0.06V for energy-efficient operation
16-bit data width for high throughput per chip
Integrated DLL for accurate timing and synchronization
Auto-refresh, self-refresh, and deep power-down supported
Wide operating temperature (-40°C to +95°C) for industrial-grade use
Compact 96-ball FBGA package with excellent signal integrity and thermal design

Applications

Server and data center memory modules
Networking and storage systems
Industrial automation and embedded controllers
Automotive infotainment and AI computing units
Consumer electronics and high-end display devices

Technical Specifications

Parameter	Value
Density	16 Gb (1G × 16)
Data Rate	3200 Mbps
VDD	1.2V ± 0.06V
Package	96-Ball FBGA
Dimension	9 × 8 × 1.2 mm
Temp Range	-40°C ~ +95°C
Timing	CL = 22 @ 3200 Mbps
Data Width	×16
Functions	DLL, Auto/Self Refresh
Interface	SSTL_12

Request for Quotation

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