K4AAG165WC-BCWE | Samsung DDR4 16Gb ×16 SDRAM Memory Chip | High-speed, low-power industrial-grade memory

K4AAG165WC- BCWE

High-performance 16Gb ×16 DDR4 memory chip for servers, industrial, and automotive applications.

Product Description

Product Overview

K4AAG165WC-BCWE is a high-performance 16Gb DDR4 SDRAM from Samsung Semiconductor, organized as 1G × 16 and compliant with JEDEC DDR4 standards. It delivers data rates up to 3200 Mbps while operating at only 1.2V, offering exceptional bandwidth with reduced power consumption. With its 96-ball FBGA package, the chip ensures superior thermal stability and signal integrity, making it ideal for servers, networking, AI computing, industrial control, and automotive systems require long-term reliability.

Key Features

JEDEC-compliant DDR4 SDRAM standard
Supports data rates up to 3200 Mbps (DDR4-3200)
Operates at 1.2V ± 0.06V for energy efficiency
16-bit data width for enhanced throughput
Integrated DLL for precise timing synchronization
Auto-refresh, self-refresh, and deep power-down modes
Wide operating temperature (-40°C to +95°C) for industrial-grade use
Compact 96-ball FBGA package for excellent signal and thermal performance

Applications

Server and data center memory modules
Networking and storage systems
Industrial automation and embedded devices
Automotive infotainment and AI computing platforms
Consumer and high-performance control systems

Technical Specifications

Parameter	Value
Density	16 Gb (1G × 16)
Data Rate	3200 Mbps
VDD	1.2V ± 0.06V
Package	96-Ball FBGA
Dimension	9 × 8 × 1.2 mm
Temp Range	-40°C ~ +95°C
Timing	CL = 22 @ 3200 Mbps
Data Width	×16
Functions	DLL, Auto/Self Refresh
Interface	SSTL_12

Request for Quotation

For real-time stock, pricing, and delivery information of K4AAG165WC-BCWE, please include your Quantity (Qty), Required Lead Time, and Target Price in the RFQ. Our team will promptly offer the best quotation and support for BOM kitting, spot supply, and inventory management.