K4AAG085WC-BCWE | Samsung DDR4 8Gb SDRAM Memory Chip | High-Performance, Low-Power Memory

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K4AAG085WC- BCWE

High-performance 8Gb DDR4 memory chip designed for servers, networking, and industrial control applications.

Product Overview

     K4AAG085WC-BCWE is an 8Gb DDR4 SDRAM from Samsung Semiconductor, organized as 1G × 8. It supports data rates up to 3200 Mbps per pin while operating at just 1.2V, delivering exceptional performance with low power consumption. The 96-ball FBGA package ensures robust signal integrity and thermal stability, making it ideal for servers, networking systems, and industrial embedded platforms requiring long-term reliability.

 

Key Features

  • JEDEC-compliant DDR4 SDRAM standard
  • Supports DDR4-3200 data rate (3200 Mbps per pin)
  • Operates at low voltage 1.2 V ± 0.06 V
  • 8-bank architecture for optimized data access
  • Integrated DLL for precise timing and synchronization
  • Auto-refresh, self-refresh, and deep power-down support
  • 96-ball FBGA package for enhanced signal integrity
  • Wide temperature range (-40 °C to +95 °C) for industrial-grade use

 

Applications

  • Server and data center memory modules
  • Networking and routing equipment
  • Industrial automation and embedded systems
  • Automotive infotainment and AI control units
  • Consumer electronics and high-end display devices

 

Technical Specifications

Parameter Value
Density 8 Gb (1G × 8)
Data Rate 3200 Mbps
VDD 1.2 V ± 0.06 V
Package 96-Ball FBGA
Dimension 9 × 8 × 1.2 mm
Temp Range -40 °C ~ +95 °C
Timing CL = 22 @ 3200 Mbps
Functions DLL, Auto/Self Refresh
Interface SSTL_12
Architecture 8 Bank

 

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