K4A8G165WG-BCWE | Samsung DDR4 8Gb ×16 SDRAM Memory Chip | High-speed, low-power industrial-grade memory

K4A8G165WG- BCWE

High-reliability 8Gb ×16 DDR4 memory chip for servers, networking, and industrial-grade applications.

Product Description

Product Overview

K4A8G165WG-BCWE is an 8Gb DDR4 SDRAM from Samsung Semiconductor, organized as 512M × 16 and compliant with JEDEC DDR4 standards. It delivers data rates up to 3200 Mbps while operating at only 1.2V, ensuring outstanding performance with low power consumption. The 96-ball FBGA package provides excellent signal integrity and compact size, making it ideal for servers, networking, automotive, and industrial systems requiring high reliability and thermal stability.

Key Features

JEDEC-compliant DDR4 SDRAM standard
Supports data rates up to 3200 Mbps (DDR4-3200)
Operates at 1.2V ± 0.06V for efficient low-power operation
16-bit data width for increased per-chip bandwidth
Integrated DLL for precise timing synchronization
Auto-refresh, self-refresh, and power-saving modes supported
Wide operating temperature (-40°C to +95°C) for industrial-grade use
Compact 96-ball FBGA package ensures superior signal and thermal performance

Applications

Server and data center memory modules
Networking and communication equipment
Industrial automation and embedded control systems
Automotive infotainment and AI computing units
Consumer electronics and advanced display systems

Technical Specifications

Parameter	Value
Density	8 Gb (512M × 16)
Data Rate	3200 Mbps
VDD	1.2V ± 0.06V
Package	96-Ball FBGA
Dimension	9 × 8 × 1.2 mm
Temp Range	-40°C ~ +95°C
Timing	CL = 22 @ 3200 Mbps
Data Width	×16
Functions	DLL, Auto/Self Refresh
Interface	SSTL_12

Request for Quotation

For real-time stock, pricing, and delivery information of K4A8G165WG-BCWE, please include your Quantity (Qty), Required Lead Time, and Target Price in the RFQ. Our team will promptly offer the best quotation and support for BOM kitting, spot supply, and inventory management.