K4A8G165WC-BCTD | Samsung DDR4 8Gb ×16 SDRAM Memory Chip | High-speed, low-power industrial-grade memory

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K4A8G165WC- BCTD

High-bandwidth 8Gb ×16 DDR4 memory chip for servers, networking, and embedded applications.

Product Overview

     K4A8G165WC-BCTD is an 8Gb DDR4 SDRAM from Samsung Semiconductor, organized as 512M × 16. Operating at 1.2V and supporting speeds up to 3200 Mbps, it offers excellent bandwidth, low power consumption, and strong signal integrity. Its compact 96-ball FBGA package makes it ideal for high-density server modules, networking systems, automotive electronics, and industrial embedded designs.

 

Key Features

  • JEDEC-compliant DDR4 SDRAM
  • Supports data rates up to 3200 Mbps (DDR4-3200)
  • Operates at 1.2V ± 0.06V for low power and high efficiency
  • 16-bit data width for enhanced bandwidth per chip
  • Integrated DLL for precise timing and synchronization
  • Auto-refresh, self-refresh, and deep power-down supported
  • Wide temperature range (-40°C to +95°C) for industrial-grade use
  • 96-ball FBGA package ensures robust signal and thermal performance

 

Applications

  • Server and data center memory modules
  • Networking and communication systems
  • Industrial automation and embedded controllers
  • Automotive infotainment and AI control units
  • Consumer electronics and high-end display products

 

Technical Specifications

Parameter Value
Density 8 Gb (512M × 16)
Data Rate 3200 Mbps
VDD 1.2V ± 0.06V
Package 96-Ball FBGA
Dimension 9 × 8 × 1.2 mm
Temp Range -40°C ~ +95°C
Timing CL = 22 @ 3200 Mbps
Data Width ×16
Functions DLL, Auto/Self Refresh
Interface SSTL_12

 

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