K4A4G165WG-BCWE | Samsung DDR4 4Gb ×16 SDRAM Memory Chip | High-speed, low-power memory

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K4A4G165WG- BCWE

High-performance 4Gb DDR4 memory chip for servers, embedded, and industrial control systems.

Product Overview

     K4A4G165WG-BCWE is a 4Gb DDR4 SDRAM from Samsung Semiconductor, organized as 256M × 16, delivering data rates up to 3200 Mbps per pin. Operating at 1.2 V, it provides excellent power efficiency and timing precision. The 96-ball FBGA package ensures compact layout, thermal stability, and long-term reliability—ideal for servers, networking equipment, industrial automation, and automotive electronics.

 

Key Features

  • JEDEC-compliant DDR4 SDRAM standard
  • Supports data rates up to 3200 Mbps (DDR4-3200)
  • Low-voltage operation (1.2 V ± 0.06 V) for energy efficiency
  • 16-bit data width for higher bandwidth per chip
  • Integrated DLL for precise timing synchronization
  • Auto-refresh, self-refresh, and power-saving modes supported
  • Wide operating temperature (-40 °C to +95 °C) for industrial and automotive use
  • 96-ball FBGA package ensures superior signal integrity

 

Applications

  • Servers and storage systems
  • Networking and routing equipment
  • Industrial control and automation systems
  • Automotive infotainment and electronic control units
  • Embedded platforms and consumer electronics

 

Technical Specifications

Parameter Value
Density 4 Gb (256M × 16)
Data Rate 3200 Mbps
VDD 1.2 V ± 0.06 V
Package 96-Ball FBGA
Dimension 9 × 8 × 1.2 mm
Temp Range -40 °C ~ +95 °C
Timing CL = 22 @ 3200 Mbps
Data Width ×16
Functions DLL, Auto/Self Refresh
Interface SSTL_12

 

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