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Design Solutions for USB, HDMI, and RJ45 Signal Integrity

Comprehensive ESD protection guide for USB, HDMI, and RJ45 interfaces using JARON ultra-low capacitance ESD arrays, ensuring signal integrity and ±15kV compliance.

Design Solutions for USB, HDMI, and RJ45 Signal Integrity

1. Background and Design Challenges

   In high-speed communication interfaces such as USB, HDMI, and RJ45, electrostatic discharge (ESD) events are one of the most critical reliability threats.

   According to IEC 61000-4-2, discharge peaks can reach ±8kV (contact) and ±15kV (air).

   Without proper protection, transient surges can instantly damage the interface ICs, cause data errors, or shorten product lifespan.

2. Key Design Objectives

   The ideal ESD protection solution must achieve low capacitance, fast response, and low clamping voltage — protecting multiple lines while maintaining signal quality across data rates from 480Mbps (USB2.0) to 10Gbps (USB3.1, HDMI2.1).

USB HDMI  (3).png

3. JARON ESD Protection Portfolio

JARON offers a complete portfolio of ESD protection products designed for high-speed signal lines, covering single-channel, dual-channel, and quad-channel array structures.

Product Series

Typical package

Capacitance value (typical)

Clamping voltage

Response time

Applicable Interfaces

ESD3V3D5U

SOD-923

0.3pF

5V

<0.5ns

USB 3.0 / HDMI 2.0

ESD5V0D3B

SOT-23

0.5pF

6V

<0.8ns

RJ45 / Ethernet

ESD9L5V0ST

SOT-563

0.4pF

5V

<0.5ns

Type-C / DisplayPort

JARON’s ESD portfolio offers ultra-low capacitance (as low as 0.3pF) and sub-nanosecond response time, suitable for USB3.1, HDMI2.1, and Gigabit Ethernet protection.

4. Design Principles for High-Speed Interfaces

Maintain Signal Integrity

   Ensure that ESD devices with capacitance ≤ 0.5pF are used, and maintain consistent differential impedance across traces to avoid reflection and signal distortion.

Minimize Return Path

   Place ESD protection close to the connector (<5mm distance) and ensure multiple ground vias for fast discharge return paths.

Layout and Symmetry

   Symmetrical placement and length matching in differential pairs preserve timing accuracy and reduce jitter in high-speed links.

5. Validation and Test Results

Test Conditions:

   ESD Test Standard: IEC 61000-4-2 ±8kV Contact Discharge

   Signal Rate: 10Gbps (HDMI 2.1)

   Equipment: JARON ESD3V3D5U (SOD-923)

Test Project

No protection

Using JARON ESD

Improvement effect

ESD residual pressure

54V

12V

↓78%

Signal eye diagram jitter

±52ps

±15ps

↓71%

BER (Bit Error Rate)

1×10⁻⁶

<1×10⁻¹²

Significant improvement

EMI interference peak

−24dBµV

−41dBµV

Improvement of 17dB

With JARON ESD arrays, residual voltage dropped from 54V to 12V, jitter reduced by 71%, and bit error rate improved by 1,000,000× — confirming superior ESD performance with full signal preservation.

6. Application Examples

USB Type-C High-Speed ​​Interface

   Utilizes JARON ESD9L5V0ST for four-channel common-mode protection;

   Withstands ±15kV air discharge;

   Signal bandwidth supports up to 10Gbps.

HDMI 2.1 Video Interface

   Utilizes ESD3V3D5U array;

   Capacitors are only 0.3pF, not affecting TMDS differential signals;

   EMI noise reduction of 16dB.

RJ45 Ethernet Interface

   Utilizes ESD5V0D3B;

   Bidirectional protection structure, compatible with PoE systems;

   Suppresses lightning strikes and electrostatic surges.

USB HDMI  (2).png

7. Selection Reference Table

Interface type

Recommended Model

Packaging

Features

USB 3.0 / 3.1

ESD3V3D5U

SOD-923

Ultra-low capacitance 0.3pF

HDMI 2.1

ESD9L5V0ST

SOT-563

Fast response time <0.5ns

RJ45 / PoE

ESD5V0D3B

SOT-23

Two-way protection, high energy absorption

8. Standards and Compatibility

Standard Number

Test content

compliant devices

IEC 61000-4-2

ESD immunity

Full series

IEC 61000-4-5

Surge test

ESD5V0D3B

IEC 61000-4-4

Burst anti-interference

ESD3V3D5U

JEDEC JESD22-A114

IC-level ESD protection

Array series

All JARON ESD components meet international standards, including IEC 61000-4-2 and JEDEC A114, ensuring compatibility with global OEM qualification processes.

9. Engineering Value and Design Benefits

Dimension

Improvement effect

Signal Integrity

Increase by 70%

ESD resistance

Upgraded to ±15kV

EMI suppression

Improvement of 16–18 dB

Module space

Save 50%

Verification cycle

shorten by 60%

JARON’s ultra-low-capacitance ESD devices deliver high-speed integrity with robust ±15kV protection — minimizing space, cost, and validation time.

10. Conclusion

   In high-speed data transmission interfaces, traditional ESD diodes can no longer simultaneously provide protection and signal integrity.

   JARON's ultra-low capacitance ESD array achieves an engineering balance between protection and performance through high response speed and extremely low parasitic effects.

   It has been widely used in high-speed interface designs such as USB Type-C, HDMI, Ethernet, and DisplayPort, becoming a standard protection solution for next-generation communication devices.

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